ISO 9001:2008



  • State of the art machinery and facilities with 100k controlled manufacturing environment ensures best possible output and quality
  • Proven World Class delivery and quality performance
  • Advanced packaging technology provider for electronic modules
    • Low Temperature Co-Fired Ceramics (LTCC)
    • Thick Film Hybrids
    • Flex based substrates
    • Glass
    • FR4
  • Complete range manufacturing process including SMD, Die bonding, wire bonding, encapsulation, laser trimming of passives, functional trimming, AQI (X-Ray inspection, ageing, testing).
  • ISO 9001:2000
  • Audited by worlds leading companies operating in Medical, Military, Aerospace, Telecom, Automotive and Industrial sectors