Manufacturing
- State of the art machinery and facilities with 100k
controlled manufacturing environment ensures best possible output and
quality
- Proven World Class delivery and quality performance
- Advanced
packaging technology provider for
electronic modules
- Low Temperature
Co-Fired Ceramics (LTCC)
- Thick Film Hybrids
- Flex based
substrates
- Glass
- FR4
- Complete range
manufacturing process including SMD, Die bonding, wire bonding, encapsulation, laser trimming of
passives, functional trimming, AQI (X-Ray inspection, ageing, testing).
- ISO 9001:2000,
ISO/TS 16949, ISO 14001:2004
- Audited by worlds
leading companies operating in Medical, Military, Aerospace, Telecom,
Automotive and Industrial sectors
