Low Temperature Co-fired Ceramics

LTCC is i a multilayer ceramic technology, resembling organic printed circuit boards. A typical module consists of a number of ceramic layers with printed concuctors and other integrated passive components. The sheets are laminated and co-fired at 850 ºC to form a multilayer interconnection substrate. Cavities and other kind of mechanical structures enabled by processing the substrate in soft state makes the LTCC a true 3D-substrate technology. LTCC combines the good properties of inorganic materials and high wiring density of a multilayer structure.

LTCC substrate can be post processed using conventional thick film processes for example for additional layers and patterns. Fine line printing methods can be used to achieve the best line definition.