Selmic is a leading European player with strong technology and competence base
We offer advanced packaging technologies for electronic modules. Our core competences are in different substrates, bare die assembly technologies, SMT processes and system integration.
Take advantage of our profound knowledge in ceramic substrates and special design capabilities for hi-rel applications.
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News
May.28.08
Selmic advanced packaging technology in NASA Phoenix Mars Lander.
Selmic has been delivering advanced packaging technology for two pressure sensors of the landers meteorological unit. The sensors are measuring atmosphere pressure in Mars.
May.12.08
Esju Oy and Selmic Oy have signed a co-operation agreement
Esju Oy and Selmic Oy have entered into an agreement to tighthen their co-operation. With the agreement, the companies complement each others in their core competence areas.