Selmic is an leading electronic's manufacturer with strong technology and competence base
Our core competences are ceramics substrates like Thick Film and LTCC (Low Temperature Co-Fired Ceramics), bare die processing including die & wire bonding, advanced packaging technologies, assembly technologies including SMT pick&place, and system integration.
Our production facilities are located in Tallinn (Estonia) and Turku (Finland), R&S sites are Oulu (Finland) and Tallinn (Estonia).
Take advantage of our profound knowledge and versatile production capabilities.
Please visit Selmic at the SMT Hybrid Packaging fair 5-7 May 2015 in Nuremberg, Germany (booth 7A-329 in hall 7A).
The new, fully automated production line for LTCC (Low Temperature Co-Fired Ceramics) is now in operational use.