Selmic is an leading electronics manufacturer with strong technology and competence
Our core competences are ceramics substrates like Thick Film and LTCC (Low Temperature Co-Fired Ceramics), bare die processing including die & wire bonding, advanced packaging technologies, assembly technologies including SMT pick &place, and system integration.
Our production facilities are located in Tallinn (Estonia) and Turku (Finland), R&D sites are Oulu (Finland) and Tallinn (Estonia).
Take advantage of our profound knowledge and versatile production capabilities.
Please visit Selmic at the SMT Hybrid Packaging fair 26-28 April 2016 in Nuremberg, Germany (booth 6-325 in hall 6).
Please visit Selmic at the SENSOR+TEST 2016 fair 10-12th May 2016 in Nuremberg, Germany (stand 5-348 in Hall 5)
The new, fully automated production line for LTCC (Low Temperature Co-Fired Ceramics) is now in operational use.